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CHINA SEMICONDUCTOR NETWORK / RESEARCH · PROCUREMENT · PATENTS

China’s semiconductor network

BlackGrove maps the Chinese semiconductor ecosystem as a set of observed relationships between companies, universities, institutes, and laboratories. Research, procurement, and patent data each capture a different part of that system. Taken together, they allow us to examine where activity is concentrated, which organizations connect otherwise separate groups, and how institutional research links into a wider industrial base.

NETWORK COMPOSITION

Three relationship layers. 53,448 resolved entities.

The current graph contains 240,365 observed relationships across research, procurement, and patents. Source records are resolved to canonical entities without discarding the underlying observations, with evidence retained upstream. The NAURA lite view carries aggregate records but no document-level evidence links.

NETWORK EXPLORER

Research meets industry.

CAS + NAURA · one network
60 of 3,377 matches · +73 seed/path nodes · 176 ties on this page
CAS NAURA XIAN MICROELECTRONICS TECH ... JIANGSU YINGCAI MICRO ELECT... 中芯集成电路制造(绍兴)有限公司 深圳市宝盛自动化设备有限公司 SHANGHAI JITA SEMICONDUCTOR... 无锡鲸芯半导体科技有限公司 Fudan University 中电科思仪科技股份有限公司 SHANGHAI HUALI INTEGRATED C... HK JARED INTERNATIONAL TRAD... Harbin Institute of Technology KOYO THERMO SYSTEMS CO.,LTD WUHAN CHINA STAR OPTOELECTR... JIUZHIYANG INFRARED SYSTEM ... University of Electronic Sc... 上海盛剑环境系统科技有限公司 Dalian University of Techno... 天津鑫利盛达科技有限公司 BEIJING YANDONG MICROELECTR... 北京华采招标代理有限公司 University of Science and T... 网鼎明天科技有限公司 中科信工程咨询(北京)有限责任公司 上海微电子装备有限公司 江苏省设备成套股份有限公司 株式会社岩崎制作所 Tokyo Electron Limited SHINSEGYE ENGINEERING CO.,LTD Ningbo Institute of Industr... 旭东机械工业股份有限公司 YIXING CRRC TIMES SEMICONDU... WI-A Corporation 上海国际招标有限公司 Leed Corporation Wuhan University NAKAN TECHNO CO., LTD BOE TECHNOLOGY GROUP CO LTD Semi Sysco Co.,Ltd JIANGSU CHANGJIANG ELECTRON... BFTECH CO.LTD 湖南省招标有限责任公司 ATS Co., Ltd Nankai University CETC BEIJING ELECTRONIC EQU... 江苏海外集团国际工程咨询有限公司 BEIJING JINGYI JINGWEI TECH... 中航技国际经贸发展有限公司 MEERECOMPANY INC Beijing BOE Technology Deve... Seyang Electronics Co., Ltd Chongqing University SHINDO ENG. LAB., LTD Nanjing University of Posts... BEIJING C&W TECH DEVELOPMEN... Xi'an Jiaotong University 大元F&C East China Normal University BEIJING E TOWN SEMICONDUCTO... SHENZHEN CHINA STAR OPTOELE... SINEVA INTELLIGENT CORPORAT... 西北(陕西)国际招标有限公司 北京国科军友工程咨询有限公司 陕西恒信项目管理有限公司 西安建工建设工程招标有限公司 中招国际招标有限公司 香港铂镭科技国际有限公司 先进太平洋(香港)有限公司 芯微科技(香港)有限公司 西安森创仪器设备有限公司 GMC SEMICONDUCTOR TECHNOLOG... 中化商务有限公司 伟亚科技(香港)国际有限公司 Hongkong CR International C... SHANGHAI BETONE SEMICONDUCT... 创世杰科技(香港)有限公司 香港共晶电子科技有限公司 奥肯思(北京)科技有限公司 陕西三海电子科技有限公司 亿源企业有限公司 亦立科技有限公司 SEMITEK INSTRUMENTS LTD 合肥芯硕半导体有限公司 三吉世纪科技有限公司 师桥科技(香港)控股有限公司 耀创科技(香港)有限公司 Alpha Plasma Asia Pte Ltd 仪准科技(香港)有限公司 SHANGHAI MICRO ELECTRONICS ... 合智(香港)有限公司 ANHUI JINGWEI TECH CO LTD 北京世纪德辰通信技术有限公司 上海希斯美珂机电有限公司 SUSS MicroTec Lithography GmbH 株式会社东京精密 Applied Materials South Eas... 宝林国际电子工程有限公司 VITO TECHNOLOGY LIMITED FUTURE SPEEDS TECHNOLOGIES LTD 美国奥泰公司 北京北方微电子基地设备工艺研究中心有限责任公司 倍瑟电子(香港)有限公司 SHANGHAI NOKIDA TECH CO LTD Oxford Instruments Plasma T... 先进装配系统有限公司 HUBEI SANJIANG AEROSPACE HO... 苏州达格贸易有限公司 梦想企业香港有限公司 北京市华科机电高技术实业公司 Maestech Co.,Ltd 上海精典电子有限公司 迪思科科技(中国)有限公司 Muehlbauer GmbH & Co. KG 深锋科技有限公司 苏州捷拓达电子科技有限公司 上海稼申自动化设备有限公司 广东省中科进出口有限公司 西安四通信息技术有限责任公司 香港迪伦科技有限公司 北京麦克沃根科技有限公司 吉创国际有限公司 北京芯人类科技有限公司 Semiconductor Technologies&... 香港优宁电子科技有限公司 森美协尔国际有限公司 香港英铂仪器实业有限公司 吉永商事有限公司 双程科技股份有限公司 硅密(常州)电子设备有限公司 西安西经进出口有限公司 上海涵澄实业有限公司 杭州可靠性仪器厂

Both seeds and connecting paths stay visible. Click to inspect; scroll to zoom.

CAS
NAURA
Shared

Score population: 13,473 entities · combined CAS + NAURA two-hop union. Betweenness: sampled: up to 300 sources per component. Scores stay fixed when filtering.

112 shared entities within CAS 2 / NAURA 2 hops, before other filters. Hops and path context use all relationships, traversed in either direction. Arrows preserve observed direction; filtered-out edges stay hidden. The lite export lacks document-level evidence links. Historical paths do not imply simultaneous supply or control.

Canonical entities

53,448from 77,210 source records

Aggregate edges

240,365all three observed layers

Evidence rows

750,778document/event support

Multi-source entities

2,340entities appearing across sources

INTERPRETING STRUCTURE

Different layers answer different questions.

Research and patent relationships are treated as symmetric. Procurement keeps the original buyer-to-bidder direction for awards, contracts and candidates; agency runs agent to buyer. SameAs links are used for entity resolution and are never counted as substantive relationships.

Cross-layer participation captures whether the same organization is visible in research, patents, and procurement, while brokerage captures the extent to which an organization connects otherwise less-connected parts of the network. A highly connected institution can be deeply embedded within one community without serving as a bridge between communities. These are different structural positions and are measured separately. Every score is retained with the graph projection, time window, and analytical configuration used to calculate it.

STRUCTURAL MEASURES

rᵢ = α Σⱼ wⱼᵢ rⱼ / Σₖ wⱼₖ + (1−α)/Nout(v) = Σᵤ wᵥᵤ in(v) = Σᵤ wᵤᵥC(v) = 2T(v) / (d(v)(d(v)−1))constraint(v) = Σⱼ (pᵥⱼ + Σ_q pᵥq p_qj)²participation(v) = |{layers containing v}| / |layers|

Weighted PageRank, directed degree, weighted Brandes betweenness, k-core, clustering, Burt constraint, effective size, and layer participation are calculated separately.

METHOD AND LIMITS

How the graph is built.

Sources. The graph combines research collaboration, patent co-assignment, and public procurement records.

Entity resolution. Records that refer to the same organization are resolved to one canonical entity. The source records remain attached for review.

Direction. Procurement is buyer → bidder; agent → buyer. CoAuthorship and CoPatentee are treated as undirected relations.

Neighborhood. The interactive view starts from one seed entity. One-hop nodes connect directly to it. Two-hop nodes are reached through one intermediate entity.

CAS TWO-HOP SAMPLE / SOURCE-EXPORT ANALYSIS

A two-hop view from the Chinese Academy of Sciences.

This view starts with the Chinese Academy of Sciences and follows the network outward for two steps. It contains 120 canonical entities: the seed, 60 direct connections, and 59 entities reached through those first-hop organizations. The bounded neighborhood preserves the institutional context around CAS while showing where its research network begins to intersect with buyers, bidders, patent applicants, and industrial companies.

01

The core is overwhelmingly research-driven.

Research collaboration accounts for 1,988 of the 2,205 relationships in this neighborhood. The Chinese Academy of Sciences has 70 direct ties here, all of them co-authorship relationships, including strong connections to the University of Chinese Academy of Sciences, the Institute of Semiconductors, the Institute of Microelectronics, and the Shanghai Institute of Microsystem and Information Technology. The immediate structure is institutional and research-heavy. CAS sits inside a dense set of specialist organizations rather than connecting evenly across the wider semiconductor economy.

02

Procurement sits around the research core.

The seed has no direct procurement relationship in this view. The 185 observed buyer-to-bidder relationships appear among organizations one and two steps away. CAS occupies a research-centered position, while procurement activity emerges around the organizations connected to it. Research institutions and purchasing organizations therefore occupy different positions within the same ecosystem, with the connection between them becoming clearer as the network moves outward from the research core.

03

A small number of organizations carry most of the brokerage.

Only 45 of the 120 entities have non-zero betweenness in the combined projection. The highest values belong to the Chinese Academy of Sciences, the Institute of Microelectronics, Peking University, Nanjing University, and BOE Technology Group. A disproportionate share of efficient paths in the neighborhood pass through this small group. Betweenness identifies brokerage within the observed network; it does not by itself measure organizational capability, size, or influence.

04

Many of the main bridge organizations appear in all three layers.

Forty of the 60 first-hop entities appear in more than one relationship layer, and 22 appear in all three. The Institute of Microelectronics, Peking University, Nanjing University, Zhejiang University, Fudan University, and Xidian University combine research, procurement, and patent activity with comparatively high brokerage scores. These organizations occupy more than one institutional role at once. They appear across multiple layers while also connecting parts of the network that are less directly connected to one another.

05

The neighborhood is dense, but its bridges are less redundant.

Median clustering in the combined network is 0.84, indicating a strongly interconnected local structure. The leading brokers also tend to have lower Burt constraint and larger effective size, meaning their contacts overlap less with one another. Dense local connectivity and brokerage are not the same thing. Some organizations are deeply embedded within tightly connected communities, while others connect groups with fewer alternative paths between them. Those bridge positions can be consequential even when the organizations themselves are not the largest or most densely connected nodes in the graph.

06

The second hop is where the industrial footprint expands.

The 59 second-hop entities add buyers, bidders, patent applicants, and industrial organizations that do not connect directly to the seed. Their average PageRank and betweenness are lower in this bounded view, in part because of how the neighborhood is constructed. This is also where the network begins to move beyond CAS's immediate institutional research environment and into a wider set of industrial and technical actors.

WHAT THIS MEANS FOR THE SEMICONDUCTOR INDUSTRY

Semiconductor capability does not move through a single supply chain.

Semiconductor development in China does not appear here as a simple progression from research institute, to manufacturer, to customer. Research, procurement, and patent relationships form overlapping systems, and different organizations occupy different positions within each of them. Technical capability can therefore develop in one part of the network before becoming visible in another.

The CAS neighborhood shows this clearly. Its immediate structure is dominated by research relationships, while procurement and patent activity become more prominent further from the seed. Expertise and technical work are concentrated inside a dense institutional research environment, but the organizations surrounding that environment connect it to buyers, suppliers, patent holders, bidders, and industrial firms. The movement from research into production is therefore unlikely to be captured by following a single institutional chain.

Some of the most revealing organizations are the ones that appear across several layers. An institute may collaborate on research, share patent activity with another organization, and sit close to a procurement relationship without itself being a major buyer or supplier. Those combinations show where technical knowledge, industrial demand, and production capacity come into contact.

They also create less obvious forms of exposure.

A commercial supplier does not need a direct relationship with the Chinese Academy of Sciences, a major state laboratory, or another sensitive institution to sit inside the same industrial system. It may instead be connected through a customer, university laboratory, joint patent applicant, bidder, contractor, or second-order supplier. Examined individually, each relationship may appear routine. Reconstructed as a network, the same relationships can place a firm much closer to a research or industrial cluster than its immediate counterparty suggests.

The same applies to upstream dependency. A company may understand who it purchases from while having much less visibility into the research institutions, patent relationships, specialist suppliers, or downstream customers connected to that supplier. The relevant unit of analysis is therefore not only the firm or transaction. It is the firm's position within the wider network through which technical knowledge, demand, components, equipment, and industrial capacity circulate.

This does not mean that every indirect connection represents technology transfer, control, or material dependency. A co-authorship relationship is not evidence of procurement, and proximity in a network is not evidence that technology moved between two organizations. What the graph provides is a way to identify the pathways along which those relationships could develop and to distinguish ordinary proximity from repeated structural overlap.

The strongest cases are likely to be those that persist across layers and across time. Where the same organizations repeatedly connect research, patents, and procurement, and continue to occupy bridge positions under different network specifications, there is a stronger basis for examining how capability is being developed, commercialized, and distributed through the semiconductor ecosystem.

Conventional supplier lists capture immediate counterparties but miss much of this structure. Situating firms within the surrounding research, procurement, and patent networks makes indirect dependencies visible and shows where exposure can arise through organizations that would otherwise appear peripheral to the relationship being examined.

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